This document defines minimum stress test driven qualification requirements and references test conditions for qualification of discrete semiconductors (e.g.
These tests are capable of stimulating and precipitating semiconductor device and package failures. This document contains a set of failure mechanism based stress tests and defines the minimum stress test driven qualification requirements and references test conditions for qualification of Integrated circuits (ICs). AEC – Q100: Failure Mechanism Based Stress Test Qualification For Integrated Circuits.Most commonly referenced AEC documents are: The technical documents developed by the AEC Component Technical Committee are available at the AEC web site. The AEC Component Technical Committee is the standardization body for establishing Standards for Reliable, High Quality Electronic components.ĪEC documents are designed to serve the automotive electronics industry through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for use by those other than AEC members, whether the standard is to be used either domestically or internationally.Ĭomponents meeting these specifications are suitable for use in the harsh automotive environment without additional component-level qualification testing. The Automotive Electronics Council ( AEC) is an organization with purpose of establishing common part-qualification and quality-system standards.
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